Amperion

Manufacturing · The build

In development

The factory behind the copper spine.

North America has no specialist facility for validated, high-voltage laminated copper interconnects at the scale AI infrastructure will require. Amperion is building it — phased, capital-disciplined, tied to real production awards.

3D render of Amperion's lamination cell — copper accent lighting and lamination presses
Render · Lamination hall · concept visualization

Build-out

Three phases. One recipe.

Each phase unlocks against real commercial milestones — paid programmes, production awards, backlog — not a burn calendar.

Phase 01
Active · 2026

Pilot lamination cell

A single lamination press, dielectric prep bench, and electrical test station in a leased GTA facility. Enough capacity for first-article and low-rate initial production.

≤ 500 units / yr
Phase 02
Planned · 2027

Purpose-built facility

≈ 6,500 m² dedicated facility with lamination line, plating interface, in-house quality lab, cleanroom, and serialized production flow. Financed by the pilot round.

3,000 – 5,000 units / yr
Phase 03
Planned · 2028+

In-house copper cutting

Laser or punching line brought in-house on the back of committed backlog. Full vertical integration from copper coil to serialized shipped module.

10,000+ units / yr

Floor plan

Eight zones. One flow.

Copper enters. A serialized, tested, traceable module ships. The path in between is short and deliberate — every zone has one job, one measurement, and one hand-off.

  • 101
    Copper preparation
    Coil handling, deburring, edge rounding.
  • 102
    Plating interface
    Tin / nickel / silver — contract-plated to spec, incoming inspection.
  • 103
    Dielectric cutting
    Insulation film die-cut and stored under class-controlled conditions.
  • 104
    Lamination presses
    Vacuum · heat · pressure. Cycle-perfect. Recipe-controlled.
  • 105
    Electrical test bay
    Rdc, IR, hipot, partial-discharge to IEC 60270:2025.
  • 106
    Quality lab
    Optical, X-ray, cross-section, AOI, dimensional metrology.
  • 107
    Cleanroom
    Controlled assembly for high-voltage insulation stacks.
  • 108
    Shipping
    Serialized, traceable, first-article records attached.
Facility floor plan blueprint — labelled zones for copper prep, plating, dielectric cutting, lamination presses, electrical test, quality lab, cleanroom, and shipping
Fig. 01 · AE-MFG-100-FP · Floor plan
Lamination press for copper busbars — annotated exploded view
Fig. 02 · Lamination press · LPB-2000 reference

Core equipment

Vacuum, heat, pressure.

The lamination press is the heart of the facility — a temperature-controlled, PLC-monitored, 2,000 kN cycle that fuses copper conductors and dielectric films into a single serialized assembly. Every cycle is logged.

2,000
kN press force
1200×800
mm platen
180 °C
heating class
PLC
logged cycles

The build is what we're raising for

The technology exists. The facility is next.

Investor materialsPowerSpine 800